THERMAL ANALYSIS ON MICROELECTRONIC HEAT SINK BY CFD USING RECTANGULAR AND TRAPEZOIDAL FIN ARRAYS. International Journal of Engineering Sciences & Management Research, [S. l.], v. 4, n. 1, p. 120–131, 2017. Disponível em: https://ijesmr.com/index.php/ijesmr/article/view/304. Acesso em: 4 feb. 2026.