THERMAL ANALYSIS ON MICROELECTRONIC HEAT SINK BY CFD USING RECTANGULAR AND TRAPEZOIDAL FIN ARRAYS

Abstract

The concern about thermal performance of microelectronics cooling is on the increase due to recent overheating induced failures which have led to product recalls. Removal of waste heat from microelectronic systems with the use of heat sinks could improve thermal efficiency of the system. The present work investigates the effect of change in aluminum heat sink geometry on thermal performance Sinks with two models with rectangular and trapezoidal fins are taken. heat transfer analysis were conducted to investigate the thermal performance of air cooling through heat sink rectangular cross section with dimensions of 55mm×1mm×20mm and the other of trapezoidal with dimension of 55mm× 0.25mm×20mm. Nine channels of each configuration are modeled on aluminium base. The measurements were performed under steady state with air velocity of 2 m/s, and at temperatures varying from 60°C-1100C in steps of 100C. Theoretical results are compared with numerical analysis with fluent15.0. Graphs are drawn, to show the performance of array of rectangular and trapezoidal fins using CFD.